Launch Date Q1'11
Lithography 32 nm
CPU Specifications
Total Cores 2
Total Threads 4
Max Turbo Frequency 3.20 GHz
Intel® Turbo Boost Technology 2.0 Frequency‡ 3.20 GHz
Processor Base Frequency 2.50 GHz
Cache 3 MB Intel® Smart Cache
Bus Speed 5 GT/s
TDP 35 W
Max Memory Size (dependent on memory type) 16 GB
Memory Types DDR3 1066/1333
Max # of Memory Channels 2
Max Memory Bandwidth 21.3 GB/s
Processor Graphics
Processor Graphics Intel® HD Graphics 3000
Graphics Base Frequency 650 MHz
Graphics Max Dynamic Frequency 1.30 GHz
Graphics Output eDP/DP/HDMI/SDVO/CRT
Intel® Quick Sync Video
Intel® InTru™ 3D Technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® Clear Video HD Technology
# of Displays Supported 2
Device ID 0x116
Expansion Options
PCI Express Revision 2.0
PCI Express Configurations 1x16, 2x8, 1x8+2x4
Max # of PCI Express Lanes 16
Package Specifications
Sockets Supported PPGA988
Max CPU Configuration 1
TJUNCTION 100 C
Package Size 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023)
Advanced Technologies
Intel® Turbo Boost Technology 2.0
Intel vPro® Platform Eligibility
Intel® Hyper-Threading Technology
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Intel® 64
Instruction Set 64-bit
Instruction Set Extensions Intel® AVX
Intel® My WiFi Technology
4G WiMAX Wireless Technology
Idle States
Enhanced Intel SpeedStep® Technology
Thermal Monitoring Technologies
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Identity Protection Technology
Security & Reliability
Intel® AES New Instructions
Intel® Trusted Execution Technology
Execute Disable Bit
Anti-Theft Technology
