Qualcomm SDM845 Snapdragon 845

The Snapdragon 845 was announced on December 7, 2017.

Snapdragon 845's notable features:

CPU features
- Samsung 10nm FinFET Low-Power Plus fabrication
- 4 Kryo 385 Gold (ARM Cortex-A75 based)
  - L1 cache: 64 KB + 64 KB
  - L2 cache: 256 KB
- 4 Kryo 385 Silver (ARM Cortex-A55 based)
- DynamIQ with 2 MiB L3 cache

3 MiB system-level cache for CPU, GPU, DSP...

GPU features
- Adreno 630 graphics with support for Vulkan 1.1, DirectX 12 (Feature level 12_1), OpenCL 2.0, OpenGL ES 3.2 and DxNext eXtended Reality (XR)
- Dual-Core GPU @ 710 MHz with 512 ALUs, 24 TMUs and 16 ROPs (up from 512 ALUs, 16 TMUs and 12 ROPs)
- 727.04 GFLOPs, 17.04 GTexels/s and 11.36 GPixels/s
- Inside-out Room-Scale 6DoF with simultaneous localization and mapping (SLAM)
- Advanced visual inertial odometry (VIO) And Adreno Foveation
- Support for HDR10 and Hybrid Log-Gamma (HLG)
- DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery

DSP features
- Hexagon 685 3rd generation "AI engine" with greater than 3 trillion operations per second (TOPS)
- Hexagon Vector eXtensions
- All-Ways Aware™ Hub low power island
- Neural Processing Engine (NPE)
- Caffe, Caffe2, Halide and TensorFlow support
- 4K Ultra HD @ 60 FPS, 2x 2400x2400 @ 120 FPS (VR)
- Can record 240 FPS in 1080p and 480 FPS in 720p (Slow motion)
- 10-bit color depth (encoding and decoding) on H.264, H.265 and VP9
- BT.2020 support on DSP and GPU
ISP features:
- Qualcomm Spectra™ 280 ISP with Dual 14-bit ISPs
- 192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL
Modem and Wireless features
- Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
- Uplink: 2x20 MHz carrier aggregation, up to 64-QAM
- Bluetooth enhancements
- Ultra-low power wireless earbuds
- Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers
- Wi-Fi ad 60 GHz with external Module
- Improve GPS support : Glonass, Beidou, Galileo, QZSS and SBAS
System on a chip features
- 10 nm FinFET LPP (Samsung)
- Die size: 94 mm²
- Secure Vault (SPU)
- Qualcomm Quick Charge 4+

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