Architecture: G90
Fabrication Process: 65 nm
Die Size; 144 mm2
Transistors Count: 314M
Transistors Density: 2.2M TRAN/mm2
Cores: 48
SM: 3
TMUs: 24
ROPs: 16
Base Clock: 530 MHz
Memory Size: 512 MB GDDR3
Memory Bus Width: 256-bit
Memory Bandwidth: 51.2 GB/s
Pixel Fillrate: 8.5 GPixels/s
Texture Fillrate: 12.7 GTexel/s
SPFP Performance: 50.9 GFLOPS
Performance per W: 848 FLOPS/W
Performance per mm2: 353 FLOPS/mm2
Released: July 29th, 2008