Clock Rate: 2200 MHz
Front Side Bus: 3200
Level 1 Cache: 128 KB
Level 2 Cache: 512 KB
Number of Cores / Threads: 1 / 1
Power Consumption (TDP = Thermal Design Power): 25 Watt
Manufacturing Technology: 45 nm
Socket: S1
Features: Integrated DDR3 memory controller, MMX, 3DNow, SSE, SSE2, SSE3, SSE4A, AMD64, Enhanced Virus Protection, Virtualization
64 Bit: 64 Bit support
Architecture: x86
Announcement Date: 05/12/2010
