FCBGA1170 is a Flip-Chip Ball Grid Array package featuring 1,170 solder balls that provide dense, high-speed electrical connections between the chip and motherboard. The flip-chip design mounts the silicon die face-down, reducing signal path length and enhancing thermal dissipation for improved performance and reliability. With its large ball count, it supports wide data buses, multiple power and ground planes, and complex signal routing. FCBGA1170 is commonly used for modern CPUs, chipsets, and advanced system-on-chip devices requiring compact size, efficient heat transfer, and strong mechanical stability.