FCBGA1528 is a Ball Grid Array (BGA) processor package type used by Intel for certain 8th Generation mobile CPUs, including the Core i7-8565U. The acronym stands for Flip-Chip Ball Grid Array with 1,528 solder balls that connect the processor to the motherboard. This design allows for high pin density, efficient heat transfer, and reliable electrical performance in thin and light laptops or compact systems. FCBGA packages are permanently soldered, meaning the processor is not user-replaceable, ensuring a low-profile assembly and improved thermal characteristics for modern ultrabook and 2-in-1 devices