The FCBGA1744 is a compact flip-chip ball grid array package commonly used for modern mobile and embedded processors. Its 1,744-ball layout supports high-density signal routing, efficient power delivery, and strong thermal performance in thin devices. This package type enables manufacturers to integrate advanced CPUs, GPUs, or SoCs into slim laptops, tablets, and compact boards. FCBGA1744’s design also provides excellent electrical integrity and reliability, making it suitable for performance-focused systems that require stable operation and tight space constraints.