BGA (FP7r2) is a ball grid array socket type used by AMD for modern mobile processors, including select Ryzen™ 6000 and 7000 series chips. Designed specifically for thin-and-light laptops and compact systems, FP7r2 is a soldered package, meaning the processor is permanently attached to the motherboard and not user-replaceable. This design allows for improved power efficiency, reduced physical footprint, and better thermal characteristics compared to socketed CPUs. FP7r2 supports advanced features such as DDR5 and LPDDR5 memory, PCIe 4.0 connectivity, and modern power management technologies, making it well suited for efficient, high-performance mobile computing platforms.