The FCBGA1440 is a fine-pitch, flip-chip ball grid array (FCBGA) package featuring 1,440 solder balls arranged for high-density processor designs. Commonly used for advanced mobile, desktop, and embedded CPUs, it provides excellent thermal performance and reliable electrical connections. The flip-chip layout shortens signal paths for improved efficiency, while the dense pin configuration supports complex chip architectures, integrated graphics, and high-speed interfaces. FCBGA1440 is typically soldered directly to the motherboard, ensuring durability and compact system integration.