FCBGA1449 (Flip-Chip Ball Grid Array, 1449-ball) is a processor socket package used primarily in thin-and-light laptops and compact systems. Instead of a removable CPU, the chip is soldered directly to the motherboard using 1,449 contact balls. This design improves electrical performance, reduces space requirements, and enhances thermal efficiency, but it also means the processor is not user-upgradeable. FCBGA1449 is commonly found in 11th and 12th Gen Intel mobile processors, helping manufacturers build slimmer, more power-efficient devices with integrated features and optimized power delivery.