Qualcomm SDM845 Snapdragon 845

Qualcomm SDM845 Snapdragon 845

The Snapdragon 845 was announced on December 7, 2017.

Snapdragon 845's notable features:

  • CPU features
    • Samsung 10nm FinFET Low-Power Plus fabrication
    • 4 Kryo 385 Gold (ARM Cortex-A75 based)
      • L1 cache: 64 KB + 64 KB
      • L2 cache: 256 KB
    • 4 Kryo 385 Silver (ARM Cortex-A55 based)
    • DynamIQ with 2 MiB L3 cache
  • 3 MiB system-level cache for CPU, GPU, DSP...
  • GPU features
    • Adreno 630 graphics with support for Vulkan 1.1, DirectX 12 (Feature level 12_1), OpenCL 2.0, OpenGL ES 3.2 and DxNext eXtended Reality (XR)
    • Dual-Core GPU @ 710 MHz with 512 ALUs, 24 TMUs and 16 ROPs (up from 512 ALUs, 16 TMUs and 12 ROPs)
    • 727.04 GFLOPs, 17.04 GTexels/s and 11.36 GPixels/s
    • Inside-out Room-Scale 6DoF with simultaneous localization and mapping (SLAM)
    • Advanced visual inertial odometry (VIO) And Adreno Foveation
    • Support for HDR10 and Hybrid Log-Gamma (HLG)
    • DisplayPort, HDMI 2.0, USB Type-C 3.1 with USB Power Delivery
  • DSP features
    • Hexagon 685 3rd generation "AI engine" with greater than 3 trillion operations per second (TOPS)
    • Hexagon Vector eXtensions
    • All-Ways Aware™ Hub low power island
    • Neural Processing Engine (NPE)
    • Caffe, Caffe2, Halide and TensorFlow support
    • 4K Ultra HD @ 60 FPS, 2x 2400x2400 @ 120 FPS (VR)
    • Can record 240 FPS in 1080p and 480 FPS in 720p (Slow motion)
    • 10-bit color depth (encoding and decoding) on H.264, H.265 and VP9
    • BT.2020 support on DSP and GPU
  • ISP features:
    • Qualcomm Spectra™ 280 ISP with Dual 14-bit ISPs
    • 192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL
  • Modem and Wireless features
    • Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
    • Uplink: 2x20 MHz carrier aggregation, up to 64-QAM
    • Bluetooth enhancements
    • Ultra-low power wireless earbuds
    • Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers
    • Wi-Fi ad 60 GHz with external Module
    • Improve GPS support : Glonass, Beidou, Galileo, QZSS and SBAS
  • System on a chip features
    • 10 nm FinFET LPP (Samsung)
    • Die size: 94 mm²
    • Secure Vault (SPU)
    • Qualcomm Quick Charge 4+